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  1. general description the 74hc4024-q100 is a 7-stage binary ripple counter with a clock input (cp ), an overriding asynchronous master reset input (mr) and seven fully buffered parallel outputs (q0 to q6). the counter advances on the high-to-low transition of cp . a high on mr clears all counter stages and forces all out puts low, independent of the state of cp . each counter stage is a static toggle flip-flop. schm itt-trigger action in the clock input makes the circuit highly tolerant to slower clock rise a nd fall times. inputs include clamp diodes. this enables the use of current limiting resistors to interface inputs to voltages in excess of v cc . this product has been qualified to the automotive electronics council (aec) standard q100 (grade 1) and is suitable for use in automotive applications. 2. features and benefits ? automotive product qualif ication in accordance with aec-q100 (grade 1) ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c ? low power dissipation ? complies with jedec standard no. 7a ? esd protection: ? mil-std-883, method 3015 exceeds 2000 v ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v (c = 200 pf, r = 0 ? ) ? multiple package options 3. applications ? frequency dividing circuits ? time delay circuits 74hc4024-q100 7-stage binary ripple counter rev. 1 ? 27 november 2013 product data sheet
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 2 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 4. ordering information 5. functional diagram table 1. ordering information type number package temperature range name description version 74hc4024d-q100 ? 40 ? c to +125 ? c so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 74HC4024PW-Q100 ? 40 ? c to +125 ? c tssop14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 fig 1. logic symbol fig 2. functional diagram fig 3. iec logic symbol 001aab906 mr 2 q0 q1 q2 q3 q4 q5 q6 3 4 5 6 9 11 12 cp 1 001aab908 mr q3 q4 q5 q6 6 5 4 3 7-stage counter q0 q1 q2 12 11 9 2 cp 1 001aab907 ct = 0 ct 2 0 6 3 4 5 6 9 11 12 ctr7 + 1 fig 4. logic diagram 001aab909 rd ff 1 t cp q q mr rd ff 2 t q q rd ff 3 t q q rd ff 4 t q q rd ff 5 t q q rd ff 6 t q q rd q0 q1 q2 q3 q4 q5 q6 ff 7 t q q
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 3 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 6. pinning information 6.1 pinning 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; ? = low-to-high clock transition; ?? = high-to-low clock transition. fig 5. pin configuration +&4 & 3 9 && 0 5 qf 4  4 4  4 4  qf 4  4 *1' qf ddd               table 2. pin description symbol pin description cp 1 clock input (high-to-low, edge-triggered) mr 2 master reset input (active high) q6, q5, q4, q3, q2, q2, q1, q0 3, 4, 5, 6, 9, 11, 12 parallel output gnd 7 ground (0 v) n.c. 8, 10, 13 not connected v cc 14 supply voltage table 3. function table [1] input output mr cp qn hxl l ? no change ? count
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 4 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 8. limiting values [1] for so16 package: p tot derates linearly with 8 mw/k above 70 ? c. for tssop16 package: p tot derates linearly with 5.5 mw/k above 60 ? c. 9. recommended operating conditions table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +7 v i ik input clamping current v i < ? 0.5 v or v i >v cc +0.5 v - ? 20 ma i ok output clamping current v o < ? 0.5 v or v o >v cc +0.5v - ? 20 ma i o output current v o = ? 0.5 v to v cc +0.5v - ? 25 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? cto+125 ?c [1] - 500 mw table 5. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 2.0 5.0 6.0 v v i input voltage 0 - v cc v v o output voltage 0 - v cc v ? t/ ? v input transition rise and fall rate v cc = 2.0 v - - 625 ns/v v cc = 4.5 v - 1.67 139 ns/v v cc = 6.0 v - - 83 ns/v t amb ambient temperature ? 40 - +125 ?c
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 5 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 10. static characteristics table 6. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb =25 ?c v ih high-level input voltage v cc = 2.0 v 1.5 1.2 - v v cc = 4.5 v 3.15 2.4 - v v cc = 6.0 v 4.2 3.2 - v v il low-level input voltage v cc =2.0v - 0.8 0.5 v v cc =4.5v - 2.1 1.35 v v cc =6.0v - 2.8 1.8 v v oh high-level output voltage v i =v ih or v il i o = ? 20 ? a; v cc =2.0v 1.9 2.0 - v i o = ? 20 ? a; v cc =4.5v 4.4 4.5 - v i o = ? 20 ? a; v cc =6.0v 5.9 6.0 - v i o = ? 4ma; v cc = 4.5 v 3.98 4.32 - v i o = ? 5.2 ma; v cc = 6.0 v 5.48 5.81 - v v ol low-level output voltage v i =v ih or v il i o =20 ? a; v cc =2.0v - 0 0.1 v i o =20 ? a; v cc =4.5v - 0 0.1 v i o =20 ? a; v cc =6.0v - 0 0.1 v i o =4ma; v cc = 4.5 v - 0.15 0.26 v i o =5.2ma; v cc = 6.0 v - 0.16 0.26 v i i input leakage current v i =v cc or gnd; v cc =6.0v - - ? 0.1 ? a i cc supply current v i =v cc or gnd; i o =0a; v cc = 6.0 v - - 8.0 ? a c i input capacitance - 3.5 - pf t amb = ? 40 ? c to +85 ?c v ih high-level input voltage v cc = 2.0 v 1.5 - - v v cc = 4.5 v 3.15 - - v v cc = 6.0 v 4.2 - - v v il low-level input voltage v cc =2.0v --0.5v v cc =4.5v --1.35v v cc =6.0v --1.8v v oh high-level output voltage v i =v ih or v il i o = ? 20 ? a; v cc =2.0v 1.9--v i o = ? 20 ? a; v cc =4.5v 4.4--v i o = ? 20 ? a; v cc =6.0v 5.9--v i o = ? 4ma; v cc = 4.5 v 3.84 - - v i o = ? 5.2 ma; v cc = 6.0 v 5.34 - - v
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 6 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter v ol low-level output voltage v i =v ih or v il i o =20 ? a; v cc =2.0v --0.1v i o =20 ? a; v cc =4.5v --0.1v i o =20 ? a; v cc =6.0v --0.1v i o =4ma; v cc = 4.5 v - - 0.33 v i o =5.2ma; v cc = 6.0 v - - 0.33 v i i input leakage current v i =v cc or gnd; v cc =6.0v - - ? 1.0 ? a i cc supply current v i =v cc or gnd; i o =0a; v cc =6.0v --80 ? a t amb = ? 40 ? c to +125 ?c v ih high-level input voltage v cc = 2.0 v 1.5 - - v v cc = 4.5 v 3.15 - - v v cc = 6.0 v 4.2 - - v v il low-level input voltage v cc =2.0v --0.5v v cc =4.5v --1.35v v cc =6.0v --1.8v v oh high-level output voltage v i =v ih or v il i o = ? 20 ? a; v cc =2.0v 1.9--v i o = ? 20 ? a; v cc =4.5v 4.4--v i o = ? 20 ? a; v cc =6.0v 5.9--v i o = ? 4ma; v cc = 4.5 v 3.7 - - v i o = ? 5.2 ma; v cc = 6.0 v 5.2 - - v v ol low-level output voltage v i =v ih or v il i o =20 ? a; v cc =2.0v --0.1v i o =20 ? a; v cc =4.5v --0.1v i o =20 ? a; v cc =6.0v --0.1v i o =4ma; v cc = 4.5 v - - 0.4 v i o =5.2ma; v cc = 6.0 v - - 0.4 v i i input leakage current v i =v cc or gnd; v cc =6.0v - - ? 1.0 ? a i cc supply current v i =v cc or gnd; i o =0a; v cc =6.0v --160 ? a table 6. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 7 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 11. dynamic characteristics table 7. dynamic characteristics gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit t amb = 25 ?c t pd propagation delay cp to q0; see figure 6 [1] v cc = 2.0 v - 47 175 ns v cc = 4.5 v - 17 35 ns v cc = 6.0 v - 14 30 ns v cc =5.0v; c l =15pf - 14 - ns qn to qn+1; see figure 6 [1] v cc = 2.0 v - 25 80 ns v cc = 4.5 v - 9 16 ns v cc = 6.0 v - 7 14 ns t phl high to low propagation delay mr to q0; see figure 6 v cc = 2.0 v - 63 200 ns v cc = 4.5 v - 23 40 ns v cc = 6.0 v - 18 34 ns t t transition time see figure 6 [2] v cc = 2.0 v - 19 75 ns v cc = 4.5 v - 7 15 ns v cc = 6.0 v - 6 13 ns t w pulse width cp high or low; see figure 6 v cc = 2.0 v 8017- ns v cc = 4.5 v 16 6 - ns v cc = 6.0 v 14 5 - ns mr high; see figure 6 v cc = 2.0 v 8022- ns v cc = 4.5 v 16 8 - ns v cc = 6.0 v 14 6 - ns t rec recovery time mr to cp ; see figure 6 v cc = 2.0 v 50 6 - ns v cc = 4.5 v 10 2 - ns v cc = 6.0 v 9 2 - ns f max maximum frequency cp; see figure 6 v cc = 2.0 v 6.0 27 - mhz v cc = 4.5 v 3082- mhz v cc = 6.0 v 3598- mhz v cc =5.0v; c l =15pf - 90 - mhz c pd power dissipation capacitance v i = gnd to v cc [3] -25-pf
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 8 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter t amb = ? 40 ? c to +85 ?c t pd propagation delay cp to q0; see figure 6 [1] v cc = 2.0 v - - 220 ns v cc = 4.5 v --44ns v cc = 6.0 v --37ns qn to qn+1; see figure 6 [1] v cc = 2.0 v - - 100 ns v cc = 4.5 v --20ns v cc = 6.0 v --17ns t phl high to low propagation delay mr to q0; see figure 6 v cc = 2.0 v - - 250 ns v cc = 4.5 v --50ns v cc = 6.0 v --43ns t t transition time see figure 6 [2] v cc = 2.0 v --95ns v cc = 4.5 v --19ns v cc = 6.0 v --16ns t w pulse width cp high or low; see figure 6 v cc = 2.0 v 100 - - ns v cc = 4.5 v 20--ns v cc = 6.0 v 17--ns mr high; see figure 6 v cc = 2.0 v 100 - - ns v cc = 4.5 v 20--ns v cc = 6.0 v 17--ns t rec recovery time mr to cp ; see figure 6 v cc = 2.0 v 65--ns v cc = 4.5 v 13--ns v cc = 6.0 v 11--ns f max maximum frequency cp; see figure 6 v cc = 2.0 v 4.8--mhz v cc = 4.5 v 24--mhz v cc = 6.0 v 28--mhz table 7. dynamic characteristics ?continued gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 9 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter t amb = ? 40 ? c to +125 ?c t pd propagation delay cp to q0; see figure 6 [1] v cc = 2.0 v - - 265 ns v cc = 4.5 v --53ns v cc = 6.0 v --45ns qn to qn+1; see figure 6 [1] v cc = 2.0 v - - 120 ns v cc = 4.5 v --24ns v cc = 6.0 v --20ns t phl high to low propagation delay mr to q0; see figure 6 v cc = 2.0 v - - 300 ns v cc = 4.5 v --60ns v cc = 6.0 v --51ns t t transition time see figure 6 [2] v cc = 2.0 v - - 110 ns v cc = 4.5 v --22ns v cc = 6.0 v --19ns t w pulse width cp high or low; see figure 6 v cc = 2.0 v 120 - - ns v cc = 4.5 v 24--ns v cc = 6.0 v 20--ns mr high; see figure 6 v cc = 2.0 v 120 - - ns v cc = 4.5 v 24--ns v cc = 6.0 v 20--ns t rec recovery time mr to cp ; see figure 6 v cc = 2.0 v 75--ns v cc = 4.5 v 15--ns v cc = 6.0 v 13--ns table 7. dynamic characteristics ?continued gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 10 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter [1] t pd is the same as t plh and t phl . [2] t t is the same as t thl and t tlh . [3] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n+ ? (c l ? v cc 2 ? f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l ? v cc 2 ? f o ) = sum of outputs. 12. waveforms f max maximum frequency cp; see figure 6 v cc = 2.0 v 4.0--mhz v cc = 4.5 v 20--mhz v cc = 6.0 v 24--mhz table 7. dynamic characteristics ?continued gnd = 0 v; t r =t f =6 ns; c l = 50 pf; see figure 7 . symbol parameter conditions min typ max unit also showing the master reset (mr) pulse width, the master reset to output (qn) propagation delays and the master reset to clock (cp ) recovery time. v m = 0.5 ? v i . fig 6. waveforms showing the clock (cp ) to output (qn) propagation delays, the clock pulse width, the output transition times and the maximum frequency mr input cp input q0 or qn output t w t phl 1/f max t rec v m v m 001aab910 t plh t w t tlh t thl t phl v m 90 % 90 % 10 % 10 %
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 11 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter test data is given in table 8 . definitions for test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. fig 7. test circuit for measuring switching times ddk  w : w : w u w u w i 9 0 9 , qhjdwlyh sxovh *1' 9 , srvlwlyh sxovh *1'     9 0 9 0 9 0 w i 9 && '87 5 7 9 , 9 2 & / * table 8. test data supply voltage input load v cc v i t r , t f c l 2.0 v v cc 6 ns 50 pf 4.5 v v cc 6 ns 50 pf 6.0 v v cc 6 ns 50 pf 5.0 v v cc 6 ns 15 pf
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 12 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 13. package outline fig 8. package outline sot108-1 (so14) 81,7 $ pd[ $  $  $  e s f '   (     h + ( / / s 4 = \ z y  5()(5(1&(6 287/,1( 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ pp lqfkhv                         r r   ',0(16,216 lqfkglphqvlrqvduhghulyhgiurpwkhruljlqdoppgl phqvlrqv  1rwh 3odvwlfruphwdosurwuxvlrqvripp lqfk pd[lpxp shuvlghduhqrwlqfoxghg   627 ; z 0  $ $  $  e s ' + ( / s 4 ghwdlo; ( = h f / y 0 $ $   $     \ ( 06 slqlqgh[                                  pp vfdoh 62sodvwlfvpdoorxwolqhsdfndjhohdgverg\zlgwkp p 627
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 13 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter fig 9. package outline sot402-1 (tssop14) 81,7 $  $  $  e s f '   (     h + ( / / s 4 = \ z y  5()(5(1&(6 287/,1( 9(56,21 (8523($1 352-(&7,21 ,668('$7( ,(& -('(& -(,7$ pp                      r r     ',0(16,216 ppduhwkhruljlqdoglphqvlrqv  1rwhv 3odvwlfruphwdosurwuxvlrqvripppd[lpxpshuvlghduh qrwlqfoxghg 3odvwlflqwhuohdgsurwuxvlrqvripppd[lpxpshuvlghdu hqrwlqfoxghg   627 02   z 0 e s ' = h       $ $  $  / s 4 ghwdlo; / $   + ( ( f y 0 $ ; $ \   pp vfdoh 76623sodvwlfwklqvkulqnvpdoorxwolqhsdfndjhohdgve rg\zlgwkpp 627 $ pd[  slqlqgh[
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 14 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 14. abbreviations 15. revision history table 9. abbreviations acronym description cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mil military mm machine model table 10. revision history document id release date data sheet status change notice supersedes 74hc4024_q100 v.1 20131127 product data sheet - -
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 15 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qualified for use in automotive applications. unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74hc4024_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 27 november 2013 16 of 17 nxp semiconductors 74hc4024-q100 7-stage binary ripple counter no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74hc4024-q100 7-stage binary ripple counter ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 27 november 2013 document identifier: 74hc4024_q100 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17 contact information. . . . . . . . . . . . . . . . . . . . . 16 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17


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